What We Can Do for YOU ...

We assist our Customers in applying Advanced Packaging technologies to their electronic systems, especially for compact portable systems where packaging plays a key enabling role. We specialize in low cost flip chip & wafer level packaging technologies. 

For your current packages we provide failure and root cause analyses, reliability and qualification.

We also apply our long experience in pioneering many technologies e,g. the original electroplated solder bump technology ( at Motorola ) and much more to the development of new custom interconnect and packaging technologies ( materals, design and processes ). For our Customers we have developed new bump technologies for low cost yet fatigue resistant Bump technology  that can go down to 100 um pitch for Wafer Level Packaging.

We have also done turnkey engineering of Wafer Bumping Lines for electroless nickel bumps  

For our Clients we provide on - site technical audit of their Suppliers both in the US and Overseas for Bumping, Substrates, Assembly & Test and if needed do Supplier Technology Development.

We also license Advanced Packaging technologies developed by us

 for Wafer Level Packaging

-- low cost transfer process for solder balls

--  Pb - free Solder Capped Column Bump technology

and more  ...

APSTL Capabilities  

-- In depth analyses of package materials and processes ( Fault Isolation, Deconstruction, SEM, EDX, SIMS etc )

-- Package Failure & Root Cause Analyses

-- Package Qualification per established Industry Standards, especially for handheld systems

-- Supplier Evaluation for Technology & Process Capability per standards developed for large corporations

-- Supplier Line Down situation analyses and resolution

-- New package development, multi chip modules

-- New interconnection technologies for custom applications especially for Wafer Level and 3-d Packaging

-- License Advanced Packaging technologies developed by APSTL ( solder ball transfer at wafer level, electroless nickel bumping both short and column types, custom flip chip packages e,g. for power amplifiers )

For details please click HERE